JPH0569644B2 - - Google Patents

Info

Publication number
JPH0569644B2
JPH0569644B2 JP61138741A JP13874186A JPH0569644B2 JP H0569644 B2 JPH0569644 B2 JP H0569644B2 JP 61138741 A JP61138741 A JP 61138741A JP 13874186 A JP13874186 A JP 13874186A JP H0569644 B2 JPH0569644 B2 JP H0569644B2
Authority
JP
Japan
Prior art keywords
cutting
plate
fixed
frame
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61138741A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62297015A (ja
Inventor
Muneyuki Kawabata
Akira Kurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KIKUKAWA IRON WORKS
Original Assignee
KIKUKAWA IRON WORKS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KIKUKAWA IRON WORKS filed Critical KIKUKAWA IRON WORKS
Priority to JP13874186A priority Critical patent/JPS62297015A/ja
Publication of JPS62297015A publication Critical patent/JPS62297015A/ja
Publication of JPH0569644B2 publication Critical patent/JPH0569644B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/04—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs
    • B28D1/044—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs the saw blade being movable on slide ways
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Sawing (AREA)
JP13874186A 1986-06-14 1986-06-14 多層基板用切断機 Granted JPS62297015A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13874186A JPS62297015A (ja) 1986-06-14 1986-06-14 多層基板用切断機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13874186A JPS62297015A (ja) 1986-06-14 1986-06-14 多層基板用切断機

Publications (2)

Publication Number Publication Date
JPS62297015A JPS62297015A (ja) 1987-12-24
JPH0569644B2 true JPH0569644B2 (en]) 1993-10-01

Family

ID=15229088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13874186A Granted JPS62297015A (ja) 1986-06-14 1986-06-14 多層基板用切断機

Country Status (1)

Country Link
JP (1) JPS62297015A (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661715B2 (ja) * 1988-10-31 1994-08-17 株式会社菊川鉄工所 切断機
DE4209912A1 (de) * 1991-03-30 1992-10-01 Hoestemberghe & Kluetsch Gmbh Trennschleifmaschine zum trennen von blechen
JP4943823B2 (ja) * 2006-11-17 2012-05-30 功 吉田 プリント基板の切断機

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156483A (en) * 1976-06-21 1977-12-26 Nippon Steel Corp Device for sweeping sawn crop of hot rolled strip
JPS60219013A (ja) * 1984-04-16 1985-11-01 三菱電機株式会社 ダイシング装置

Also Published As

Publication number Publication date
JPS62297015A (ja) 1987-12-24

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